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Showing posts with label Ansys. Show all posts
Showing posts with label Ansys. Show all posts

Wednesday, August 16, 2017

Creating a Digital Twin for a Pump : PTC Thingworx and ANSYS

“The technologies that underpin the IoT make it possible to integrate simulation with products as they exist and operate in the real world.”



Simulation has long been an integral part of the product development process; it greatly improves product performance, reduces development costs and gets the product to market much more quickly. The technologies that underpin the Internet of Things now make it possible to go a step further by integrating simulation with products as they exist and operate in the real world. This opens up a whole new era in value creation for companies to optimize operations and maintenance, as well as further accelerate the new-product development process. ANSYS worked with PTC, Flowserve, National Instruments and HPE to demonstrate this, showing how a simulation model of an operating pump can diagnose and solve operating problems faster than was ever possible before.For More details connect us at digital twin with IOT
For More details connect us at digital twin with IOT

Tuesday, April 18, 2017

Multibody-Dynamics

Assuming that parts of a dynamic assembly act as purely rigid bodies is like assuming that the earth is flat: The truth won’t be known until the assumptions are challenged. There is always an element of risk involved with challenging the status quo, but, luckily, using ANSYS Flexible 

Dynamics technology is less risky than falling off the edge of the earth. When challenged with prototyping a new mechanical assembly, most engineering departments turn to a rigid dynamics software program, and for good reason. The advantages of simulating an assembly as a collection of rigid parts connected by joints are undeniable: It is much faster, more design ideas can be investigated in the same amount of time, and a product development team can be more productive. But this time savings comes at the expense of insight, and, sometimes, what isn’t known about a new design can come back to haunt a well-meaning team.

Unknowns can include:

• Will our assembly survive the first cycle, or will one of the parts buckle, break or deform so severely that the system locks up?

• Will the assembly vibrate so much that nobody will  buy it?

• Will our warranty department have to deal with the big, expensive problem of material fatigue?

• Is this a huge career-limiting mistake that our design team can’t collectively afford to make?
To gain the insight required to answer the above questions (and many others), part and joint flexibility needs to be included in the simulation.

Rigid dynamics simulation can demonstrate how quickly an assembly’s parts are moving, how fast the parts are accelerating or decelerating, and what the forces are at the joints between the parts at any time during the dynamic transient.  The total solution time for many rigid dynamics  simulations is often measured in seconds, because the number of degrees of freedom is low and all parts are assumed to be infinitely stiff. This fast solve time makes rigid dynamics extremely attractive to those with looming deadlines.

On the other hand, flexible dynamics provides these same part velocities and acceleration data, plus complete deformation, stress and strain data. While this is the information needed to really understand the design, total solution time is longer. Because of this, relying on flexible dynamics in the early stages of design development has never been commercially viable.

Smart engineers have been trying to combine the benefits of the fast solve times of rigid dynamics with the complete performance information that comes only from running a flexible FEA simulation. Several methods have been developed over the past 20 years with varying degrees of success.
Rigid Dynamics Loads to Static Simulation Method
The most basic and most widely used method of combining the benefits of rigid dynamics with those gained by using flexible system modeling is to transfer loads from a rigid dynamics run and use those loads on a structurally static system. This marriage of dissimilar technologies has some pros and cons.
Pro

• Dynamic loading on parts is captured accurately, so there is no need to estimate how far to scale up a static load to approximate a dynamic load.This widely practiced approach is sometimes  conservative, and sometimes it is not.

• Static structural simulations are some of the most efficient FEA-based solutions that accurately model flexibility.

Con

• The process forces the engineer to choose the transient time points at which to transfer to the
structural static simulation.

• Using this method, it is extremely easy to overlook the worst-case loading combinations for all but the simplest assemblies, so the wise engineer using this method applies a very large margin of safety when relying on results.
Craig–Bampton Method
A more sophisticated technique of combining rigid and flexible benefits is the Craig–Bampton method. Using this technique, the flexibility of a system is captured via a model–dynamic solution. The mode shapes and frequencies, or eigenvalues and eigen vectors, are then fed to the rigid dynamics model so that part flexibility is accounted for during a transient. While less of a forced marriage than the previous technique, the Craig–Bampton method is also blessed with pronounced strengths and weaknesses.

Pro

• A modal analysis is one of the most efficient of all dynamic simulations.

• The rigid dynamics reduced-order model gains flexibility at the lowest computational cost, and this has made the method popular with those requiring additional simulation fidelity.

Con

• The method is inherently limited to linear responses due to its reliance on modal analysis results. 

This means it is not capable of accurately modeling:

– Anything other than linear materials: no material plasticity, hyperelasticity or viscoelasticity is possible
– Real-world nonlinear contact, with or without friction and or changing contact status
– Large deflection


• The method is complicated and consumes much engineering time. Little has been done to automate, or at least streamline, the linking of the modal results with the rigid reduced-order model, likely because of the inherent limitations of the Craig–Bampton method itself.

• Design iterations are painful. Because there is significant manual interaction and data reading, writing and translating, it is nearly impossible to keep up with changes to a 3-D CAD model. Load transfer from rigid dynamics simulation model (top) to static structural model (bottom)

• Financial cost is typically very high because two expensive programs must be used, often from different software companies, and these programs are typically run by two different engineers who have been trained on one system but not both.
Rigid and Flexible Dynamics Method
The most modern method of combining the benefits of rigid and flexible dynamics is to create a general-purpose software system that can be used to model full-rigid dynamics with reduced-order models or a full-flexible dynamics assembly, or any combination thereof. For this method, an engineer uses reduced-order models in pure rigid dynamics and is able to keep pace with rapidly evolving design proposals because of the fast solve times afforded by the explicit solver. To gain further insight, the rigid model is modified with the addition of flexible component(s), and a flexible or rigid and flexible system is analyzed. While some software suppliers have pieces of the rigid and flexible dynamics method, only ANSYS offers this type of system — and it has been in commercial use for nearly two years. To consummate the relationship between rigid and flexible dynamics, the ANSYS Rigid Dynamics  product is used as an add-on to ANSYS Structural, ANSYS Mechanical or ANSYS Multiphysics software.

Pro

• A single geometry model is used for both rigid and flexible dynamics. This model is typically an easy-tovisualize
3-D model from ANSYS DesignModeler software or a CAD system.

• The same user interface is employed for both rigid and flexible dynamics, so users of one have very little to learn to be able to run the other.

• Models can be converted from rigid to flexible in minutes in as few as four mouse clicks.

• Design iterations are easy. Change the CAD model, click update, and resolve the rigid, rigid and flexible, or full-flexible model.

• The limitations of the Craig–Bampton method do not apply: that is, you are able to model nonlinear contact as well as material non linearities at the same time, if desired.

Con

• While creating a rigid and flexible model with contact and material non linearities is easy to do, sometimes these non linearities cause conflicting convergence targets for the solver. Overcoming these conflicts and getting a converged solution can require some expertise in nonlinear simulations.

• Solver requirements are higher than either of the previous two methods, which has always been the nature of a full-nonlinear transient dynamic simulation.

However, new time integration schemes and parallel processing or high-performance computing can be very effective at reducing CPU demands. Because some brave soul challenged the assumption that the earth was flat, falling off the edge of the world is less of a concern than it was centuries ago. As the state of the art in engineering simulation software continues to improve, and more engineers begin to use rigid and flexible dynamics during product development, failed product designs will become less of a concern as well.

Wednesday, December 21, 2016

Electromagnetics : Realize Your Product Promise

ANSYS electronics solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before. Our industry leading electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave. You can quickly optimize your design using simulation instead of wasting time building and testing costly prototypes. So whether it's a computer chip, a circuit board, a cell phone, an electronic component in an automobile or an entire communications system, ANSYS software can help you design better products. 


Electromagnetics
Realize Your Product Promise


Hundreds of devices that we use every day — from computers, automobiles, mobile communication devices and wireless networks to the electrical grid — depend on advanced electromagnetic equipment. Optimizing the performance of these complex designs requires accurate modeling of electromagnetic fields, circuit details and system validation.

Engineering simulation software — which enables product development and optimization in a virtual environment — has revolutionized electronics design. R&D teams define device architecture, verify specifications for functional blocks, design circuits and components, evaluate component- and system-level interactions, and optimize circuit or system performance under actual operating conditions.

No matter the discipline or industry, you can readily put these numerical tools to work to virtually optimize electrical performance and component interactions, sometimes with minimal investment in physical testing.

When you leverage this power, you have the opportunity to slash the time and costs traditionally associated with designing sophisticated electrical devices.


Consumers demand features that make electromagnetics design more complex. As a result, the opportunity to differentiate in the marketplace has been never been so pronounced. At the same time, the downside risk of product failure and its consequences can be catastrophic.


ANSYS: Powered by Technology Leadership

ANSYS advanced simulation technologies create a high level of confidence that the complex devices you design will perform reliably under real-world conditions, enabling you to fulfill your critical product promise to customers.

With proven industry-standard electromagnetic field solvers such as ANSYS HFSS,® we have emerged as the clear industry leader in electromagnetics simulation, with unmatched technology depth and breadth. Spanning the full spectrum of electromagnetic analysis and design, our tools enable companies to leverage best-in-class technology to confidently predict device behavior, dramatically reduce prototype and physical testing costs, and launch innovative, competitive products faster.
 
No other software provider offers the broad, overarching perspective on device performance that is made possible by the comprehensive

ANSYS simulation suite. From component design and baseline physics analysis to system integration and optimization, this is the ANSYS promise: to offer robust, industry-leading capabilities — so you can realize your performance promise of a wide range of low- and high-frequency/high-speed and electromechanical devices.


Signaling a New Era in Product Integrity

ANSYS helps you deliver on your product promise — by ensuring optimal power and signal integrity.

For high-speed digital devices, there are few issues more critical than achieving consistent power and signal integrity and avoiding EMI.

Realizing uncompromised signal fidelity requires detailed design of component, circuit and system levels in addition to gigabit-speed interconnections for chip-to-chip, package-to-board or board-to-board communications.
At the same time, delivering a high level of power integrity requires innovative product design that eliminates electronic power fluctuations within the PCB or device.

Ensuring signal fidelity at state-of-the-art GHz or Gb/s speeds requires a new generation of design strategies along with tools that accurately characterize signal transmission. Thirty years ago, signal integrity was not so great a design challenge, but data rates in today’s products have higher speeds, requiring greater bandwidth, while product size is decreasing. All of this contributes to SI complexity.




When a high-frequency signal travels between its source and termination, it can resonate and emit electromagnetic energy that interferes with other components in the product — as well as other products that happen to be in the area.

Simulation software from ANSYS empowers you to analyze power and signal integrity as well as EMI early in the design cycle, when the change process is most efficient and cost effective. With our broad range of high-frequency and signal integrity tools, your engineers can identify performance issues such as ringing, crosstalk, ground bounce and power supply noise.

We have strengthened our position as a technology pioneer with the integration of advanced low-power electromagnetic simulation technologies from Apache Design Solutions, Inc.


These tools are critical for designing a range of portable electronics — including smartphones, tablets and laptops — with complex power issues due to their video, GPS, recording and conferencing features that are supported by lightweight, energy-efficient batteries.

Our technology can handle the complexity of modern interconnect design from die to die across ICs, packages, connectors and boards. By leveraging advanced electromagnetic field simulators dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.

Architectural firm Takenaka Corporation develops wireless power supply systems that are embedded in the walls and floors of buildings. In designing the circuit for this system, the company coupled several ANSYS tools to determine capacitance between electrodes, to create the inductor design, and to analyze the electromagnetic radiation characteristic.

By incorporating on-chip power integrity analysis from Apache, our software delivers the capability to simulate and analyze power integrity at the chip, board and package levels. We provide the full range of capabilities needed to balance high-energy outputs with extreme energy efficiency via analysis at both the component and system levels.

ANSYS: A Transmitter for Innovation

Signal and power integrity are essential to consistent performance of a wide range of digital and electronic products. No matter the industry, engineers are using ANSYS tools to take this central product competency to new levels of reliability and innovation via early-stage engineering simulation.

For example, designers of high-speed and fast-switching circuits rely on ANSYS for the parametric data and time-domain circuit models they need to verify and tune package performance — before costly final assembly occurs.

ANSYS software helps integrated circuit engineers meet growing market demands for lower cost, lighter weight and longer battery life by supporting the functional integration of disparate circuit components. We also help product developers bring to market new mixed-signal designs that incorporate embedded high-performance analog blocks with complex digital circuitry on a single chip.



Tuesday, December 20, 2016

Electromagnetics : Realize Your Product Promise




ANSYS electronics solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before. Our industry leading electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave. You can quickly optimize your design using simulation instead of wasting time building and testing costly prototypes. So whether it's a computer chip, a circuit board, a cell phone, an electronic component in an automobile or an entire communications system, ANSYS software can help you design better products. 

Wednesday, September 14, 2016

Power Cable Analysis







Power Cable Analysis


Power cables, such as those found in subsea oil field operations, carry megawatts of power
to a variety of mission-critical pumps and motors. Several cables can be bundled together into
umbilicals that supply power to separate loads from a single source. Since these cables can
be very costly to design, manufacture and maintain, the analysis underlying their specification
must be thorough and accurate.

Products Used
ANSYS® Maxwell®, ANSYS Q3D Extractor®, ANSYS Simplorer®,
ANSYS Workbench™, ANSYS Mechanical ™, cable design kit


Keywords
Cable, power transmission, umbilical, subsea, systems simulation, circuit
extraction, thermal modeling

Introduction


Cable umbilical showing power conductors in the center with shields, hydraulic tubes, and armor strands

Power cable bundles include several sets of three-phase power groupings carrying several hundred amps at several thousand volts. The main power conductors consist of three separate phases of stranded copper, semiconducting wraps around the conductors to mitigate unintended accumulations
of charge, and high-strength dielectric insulation with individual shields to equalize and normalize the electric fields around high-voltage conductors. The entire cable bundle can be enclosed in steel strands that act as armor against unintended piercing. Each of the conductors can be slowly twisted
about themselves and the cable bundle’s center to create a more-structurally stable package.

Types of analysis typically performed for cables include:

• Cable losses due to frequency and proximity of conducting objects
• Cable electrical circuit (RLCG) and transmission line parameters
(characteristic impedance, propagation velocity)
• Field visualization (flux density, electric field intensity, current density)
• Effects of twisting on cable behavior
• Heating and temperature due to rated loads or unintended transients, such as short circuit
• Effects of loads run at different frequencies on bundle
• Effects of external seawater and flooding on cable



Parametric cross-sections along the length of the cable used for the 2D analysis


Parametric Analysis
Most cable analysis is done in 2-D, so the 3-D effect of twisting is accounted for by using parametric analysis of the axial position of the cable to capture the averaging effect of all possible twisting positions (Figure 2). Additional parametric analysis can include losses as a function of the fields; input currents are also of interest, as are cable material and geometry. High performance computing (HPC) can accelerate evaluating the large number of parameters involved in cable analysis.



System Integration

The cable can be represented in a circuit simulation using ANSYS Simplorer to account for various voltage excitations, such as square or sinusoidal. This helps to measure crosstalk or the eff ect of load transients, as seen in Figure 3. Circuit models are frequency dependent over a broadband range
of frequencies to capture the harmonic content of any reasonable signals, and the models are transmission line-capable to describe spatial wave effects along the cable’s length.


Cable Design Kit
Using the cable design kit as an add-on to ANSYS Maxwell or ANSYS Q3D Extractor, you can greatly compress the process — from problem defi nition and analysis to results extraction, shown in Figure 4. The design kit automates the input of common parameters for a set of typical cable confi gurations, generates all models needed for analysis, then analyzes and extracts the desired data. This process can greatly facilitate and automate the generation of parametric twist for 2-D models. A user can easily customize the design kit for any cable type of interest — it is written in Python, a widely used scientifi c computing language, which makes it easy to modify as needed.



Multiphysics
Electromagnetic losses can be used to determine the temperature within the cable by coupling with ANSYS Mechanical. The loss distribution is coupled spatially to capture any non-uniform heating eff ects. The effects are bidirectional: If the temperature change is large enough, the eff ect on electrogmagnetic resistance will automatically be determined. Figure 5 shows steady-state losses and temperature from a 200 A load.



Summary
ANSYS provides a robust solution for designing power cables used in subsea oil fi elds and other high-power applications. A comprehensive and automated multiphysics workfl ow provides ease of use along with accurate electromagnetic, circuit and thermal analysis of the cable prior to manufacture 

ANSYS AIM 17.2: Expanding Upfront Simulation for the Design Engineer

The latest innovations for thermal management and bolted assemblies

With today’s latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.
“We are pleased that our customers continue to benefit from the rapid development of ANSYS AIM, allowing new applications to be solved with every release,” said Walid Abu-Hadba, chief product officer, ANSYS. “The new functionality in AIM will better enable engineers to push the boundaries of product design with its enhanced upfront simulation capabilities to speed up productivity and accurately predict product performance with ease.”  



AIM enables design exploration for every engineer by providing intuitive, guided workflows, accurate simulation results, and customization in a complete simulation tool covering a broad range of physics.  AIM’s ease-of-use simulation environment minimizes training and allows engineers to quickly become productive with simulation.
“ANSYS AIM's ease-of-use has allowed us to introduce key simulation skills and concepts to students using real industrial tools early in the engineering curriculum,” said Sanjeev Bedi, professor of engineering at the University of Waterloo.
Upfront simulation improves productivity of design engineers, by enabling them to make informed decisions early in the product’s life cycle, minimizing the need for re-work and re-design later in the process.

Highlights available in ANSYS AIM 17.2 include:

Thermal Management Advances
Optimizing heat transfer and thermal stress is a critical design issue for many industry applications, including heat exchangers, thermal mixing valves, engine components and electronic devices. Accurate predictions of the temperature and heat transfer in both the fluid and solid regions is essential to accurately predict the thermal and thermal-stress performance of the design. The new version of AIM builds upon its existing, combined fluid thermal and solid thermal-stress capabilities, supporting upfront simulation to optimize the thermal and fluid performance of product designs.
Momentum and heat sources are now available for fluid and conjugate heat transfer analysis, enabling simulations to include such features as electronic package power sources, fans and filters. Heat loads from a magneto-static solution can also be applied. Additionally, the new thermal transient simulation of solids allows time-dependent effects to be considered for solid thermal models with convection and radiation boundary conditions. Thermal effects can now also be included in polymer extrusion simulations. Combined, these new features and more improve the speed and fidelity of upfront simulation for thermal management.

Better Bolted Connections
Bolted connections between components are common elements in construction and machines. Accurately simulating bolt tightening sequences and the resulting contact pressures as well as frictional stresses between the parts is required to accurately predict the structural performance of bolted connections. ANSYS AIM 17.2 provides new options for optimizing bolted connections that allow engineers to correctly model loading and bolt tightening sequences for structural assemblies.

Enhanced Collaboration
Many of today’s industry leaders are working to improve their product creation processes by having design engineers perform upfront simulation. As part of these initiatives, design engineers may need to pass their simulation models to analysts to perform more advanced simulations or to validate their results. By leveraging the power of the ANSYS Workbench platform, AIM now enables collaboration among design engineers and simulation analysts through the drag-and-drop transfer of AIM simulation models to the flagship ANSYS Mechanical environment.

Support for Native Languages
Most product design engineers are more comfortable and productive when working with software in their native language. ANSYS AIM 17.2 introduces a Japanese language user interface, making upfront simulation more accessible than ever to Japanese-speaking engineers.


ADROITEC extends their Solution Portfolio into Suite of Simulation Solutions from ANSYS.



ANSYS enables you to predict with confidence that your products will thrive in the real world. Industry leaders use ANSYS to create complete virtual prototypes of complex products and systems – comprised of mechanical, electronics and embedded software components – which incorporate all the physical phenomena that exist in real-world environments.




Adroitec Joins the Partner Eco System with ANSYS as a Channel Partner for Sales and value added service - support of ANSYS products in INDIA.

ANSYS (www.ansys.com) is headquartered in Canonsburg, Pennsylvania, U.S.A., and has more than 60 strategic sales locations throughout the world. In addition, ANSYS enlists a network of channel partners in more than 40 countries, and all together the Company fosters close partnerships with customers and provides local, value-added service and support.